Joint KAUST-IBM patent filed on novel packaging for on-chip antennas
A joint US patent has been filed by IMPACT Lab, KAUST and IBM as part of the on-going collaborative project on novel packaging techniques to improve on-chip antenna performance.
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A joint US patent has been filed by IMPACT Lab, KAUST and IBM as part of the on-going collaborative project on novel packaging techniques to improve on-chip antenna performance. Dr. Loic Marnat is working on this project from the KAUST side and Dr. Duixian Liu is the IBM collaborator. The details of the patent are below:
Loic Marnat, A. Shamim, Duixian Liu, "Package Structures to Improve On-Chip Antenna Performance", U.S. Patent Application No. 13/686377, filed on November 27, 2012.
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Loic Marnat
- Postdoctoral Research Fellow, Integrated Microwaves Packaging Antennas and Circuits Technology
