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Integrated Microwaves Packaging Antennas and Circuits Technology
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3D Integration

Nuzhat Yousf

Ph.D. Student, Electrical and Computer Engineering

3D Integration Wide Bandgap Materials Logic and Memory Technologies

Monolithic 3D integration Emerging Semiconductor Devices Wide Bandgap Materials Logic and Memory Technologies Energy-Efficient Computing

Danish Raja

Ph.D. Student, Electrical and Computer Engineering

AI Hardware In-memory computing 3D Integration

Exploring emerging semiconductor devices and Compute-in-Memory architectures for energy-efficient, high-performance AI hardware.

Integrated Microwaves Packaging Antennas and Circuits Technology (IMPACTS)

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