Skip to main content
Integrated Microwaves Packaging Antennas and Circuits Technology
IMPACTS
Integrated Microwaves Packaging Antennas and Circuits Technology
Main navigation
Home
People
Principal Investigators
Research Scientists
Postdoctoral Fellows
Students
All Profiles
Alumni
Former Members
Events
All Events
Events Calendar
News
Pages
Collaborators
Contact Us
materials science
Welcoming composite inks into the fold
1 min read ·
Thu, Oct 14 2021
News
wearables
materials science
electrical engineering
IoT
A screen-printing approach to creating foldable circuits could make many functional devices easier and cheaper to mass produce.
