Skip to main content
Integrated Microwaves Packaging Antennas and Circuits Technology
IMPACTS
Integrated Microwaves Packaging Antennas and Circuits Technology
Home
People
Publications
Book / Chapter
Conference Proceedings
Invited Presentations/Short Courses/Seminars
Journal Articles
Patents
Collaborators
Contact Us
Events
News
wearables
Welcoming composite inks into the fold
1 min read ·
Thu, Oct 14 2021
News
wearables
materials science
electrical engineering
IoT
A screen-printing approach to creating foldable circuits could make many functional devices easier and cheaper to mass produce.